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Manufacture

TRUSUN is committed to providing global customers with one-stop customized solutions for circuit boards that are high-precision and highly reliable

TRUSUN,FPC,PCB,FFCHome>Manufacture

Manufacture

FPC PCB FFC SMT

  • FPC

    TRUSUN's manufacturing strength in the FPC field is reflected in its precision standards and key process parameters. Leveraging a comprehensive process control system, we are capable of producing flexible printed circuit boards (FPC) suitable for various electronic devices, meeting the stringent requirements for performance and quality in the high-density circuit field, and providing customers with stable and reliable FPC products.

    Maximum Layer
    Maximum Layer
    It can produce structures with up to 8 layers, suitable for complex multifunctional electronic components.
    Minimum Aperture
    Minimum Aperture
    By pushing the limits of micro-via processing technology, we have successfully achieved the fabrication of 50μm micro blind vias, significantly enhancing the space utilization and integration density of circuit boards.
    Minimum line width/line spacing
    Minimum line width/line spacing
    With an excellent machining accuracy of up to 0.035 millimeters (1.38 mil), it enables compact and highly integrated circuit design.
    Dimensional Accuracy
    Dimensional Accuracy
    We maintain a stringent dimensional tolerance of ±0.05mm to guarantee perfect mechanical fit and assembly accuracy.

  • PCB

    TRUSUN possesses process capabilities such as high-precision pattern transfer, precision lamination, microvia processing, and impedance control in the PCB field, enabling the mass production of high-speed multi-layer boards and high-reliability carrier boards. Relying on full-process manufacturing control, the company provides PCB products that meet performance and reliability requirements for high-speed signal transmission, high-density interconnection, and packaging applications, and supports full-process services from R&D prototyping to mass manufacturing.

    Maximum Layer
    Maximum Layer
    Supports 1-16 layer constructions, meeting the multi-layer circuit design requirements of complex and highly integrated electronic products.
    Surface Treatment
    Surface Treatment
    HASL spray, OSP, ENIG, carbon paste, electroplated glod, nickel palladium gold, and selective plating, etc. The thickness of the electro gold on the gold finger can reach 1.5um.
    Spacing Minimum line width/line
    Minimum line width/line spacing
    The processing accuracy can reach 2mil/2mil, supporting compact layout and enabling high-density wiring on circuit boards.
    Shape and warpage control
    Shape and warpage control
    The precision mold can achieve a form tolerance of ±0.05mm, while the CNC routing has a form tolerance of ±0.075mm. The warpage control for multi-layer boards is 0.50%, and for single-layer boards is 1.50%, ensuring assembly compatibility.

  • FFC

    TRUSUN's FFC product manufacturing prowess is exemplified by its precise dimensional control and high-speed electrical performance metrics. Leveraging mature and comprehensive process management, we are capable of mass-producing flexible flat cables with both same-side and opposite-side contacts, meeting the diverse performance standards of high-speed transmission equipment. We offer reliable comprehensive solutions for FFC cables.

    Pin Specifications
    Pin Specifications
    The pin spacing covers a range of 0.3-2.54mm, supporting product customization for different pin counts from 4 to 100 pins.
    Product thickness capability
    Product thickness capability
    The finished product has a thickness range of 0.12-0.4mm, with a thickness tolerance strictly controlled at ±0.03mm. Its lightweight and compact structure is suitable for narrow installation spaces.
    High-speed transmission performance
    High-speed transmission performance
    It can achieve high-speed signal transmission ranging from 3.75Gbps to 10Gbps; supports 50Ω/100Ω impedance with an impedance tolerance of ±10%, making it suitable for high-speed signal application scenarios.
    Gold finger processing accuracy
    Gold finger processing accuracy
    The thickness of the gold finger is 0.3-0.38mm, with a tolerance of ±0.03mm, ensuring the reliability and stability of the insertion and contact.

  • SMT

    TRUSUN provides comprehensive Surface‑Mount Technology (SMT) assembly services. It offers integrated support for global customers and enables one‑stop delivery of manufactured and assembled FPC finished assemblies.

    Processing Capabilities
    Processing Capabilities
    TRUSUN supports assembly processes for 0201‑format components and 0.35 mm fine‑pitch BGA/QFN devices, meeting high‑density mounting requirements for compact, high‑performance electronic products.
    Quality Metrics
    Quality Metrics
    The first‑pass yield (FPY) can reach 99.90%, which helps cut material waste, lower production costs, and ensures stable quality and reliable performance.

Equipment DisplayContinuous investment in technical equipment ensures outstanding quality

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Production ProcessDemonstrate the process flow of FPC, PCB, and FFC